Huawei CH121L V3 Compute Node
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Model:
Huawei CH121L V3 Compute Node -
Detail:
This liquid cooling compute node combines dense computing with an ultra-large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and High-Performance Computing (HPC). -
Price:
$2000.00
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Overview
This liquid cooling compute node combines dense computing with an ultra-large memory. It is optimized for enterprise service applications such as virtualization, cloud computing, and High-Performance Computing (HPC).
Dense computing capabilities and large memory capacity for enterprise service applications — virtualization, cloud computing, and HPC clusters
- Intel® Xeon® processor E5-2600 v3/v4 family contain up to two 22-core processors to power each compute node
- 24 DDR4 DIMMs, providing a maximum memory capacity of 1.5 TB
- Reduces O&M costs with remote deployment and fault location technologies such as SOL, KVM over IP, virtual DVD-ROM drive, WebUI, and IPMI 2.0 compliance
- Nodes include efficient, secure power consumption analysis and control capabilities, including power-off mode, and Intel® NM 3.0 compliance
- Supports board-level liquid cooling; adopts integrated cooling plates without internal solder points; 80% of heat dissipated through liquid; supports individually maintainable CPUs and memory modules
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Specifications
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